Array substrate, liquid crystal display panel having the same and liquid crystal display device having the same

ABSTRACT

In an array substrate, an LCD panel having the same and an LCD device having the same, the array substrate may include an insulating substrate, a switching element (e.g., a transistor such as a TFT), a main pixel portion, a coupling capacitor and a sub-pixel portion. The switching element may be formed on the insulating substrate in a pixel region defined by gate and data lines adjacent to each other. The gate and data lines may be formed on the insulating substrate. The main pixel portion is on a first (e.g., central) portion of the pixel region. The coupling capacitor is electrically connected to the switching element. The coupling capacitor is on the insulating substrate. The sub-pixel portion is electrically connected to the coupling capacitor. The sub-pixel portion is on a second (e.g., peripheral) portion of the pixel region. Therefore, an image display quality is improved.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.12/509,193 filed on Jul. 24, 2009, which is a continuation of U.S.patent application Ser. No. 11/323,586 filed on Dec. 29, 2005, whichclaims priority to Korean Patent Application No. 2005-04275, filed onJan. 17, 2005, and Korean Patent Application No. 2005-117915, filed onDec. 6, 2005, and all the benefits accruing therefrom under 35 U.S.C.§119, and the contents of which in their entirety are hereinincorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an array substrate, a liquid crystaldisplay (LCD) panel having the array substrate and an LCD device havingthe array substrate. More particularly, the present invention relates toan array substrate capable of improving an image display quality, aliquid crystal display (LCD) panel having the array substrate and an LCDdevice having the array substrate.

2. Description of the Related Art

An LCD device, in general, may include an array substrate, a colorfilter substrate and a liquid crystal layer. The array substrate mayinclude a plurality of thin film transistors (TFTs) that are controlpixels. The color filter substrate has a common electrode. The liquidcrystal layer is sealed between the array substrate and the color filtersubstrate. A light transmittance of the liquid crystal layer is changedin response to an electric field applied to the liquid crystal layer,thereby displaying an image.

The variation of the light transmittance is restricted in apredetermined range, and as a result the LCD device has a relativelynarrow viewing angle. In order to increase the viewing angle of the LCDdevice, the LCD device may implement a vertical alignment (VA) mode.

The LCD device configured to implement the VA mode may include twosubstrates and a liquid crystal layer incorporating a liquid crystalmaterial with a dielectric constant exhibiting negative anisotropy.Liquid crystals in the liquid crystal layer have a homeotropic alignmentmode.

In operation, when a voltage is not applied to the substrates, theliquid crystals are aligned in a vertical direction to display black.When a voltage at least equal to V₀ is applied to the substrates (e.g.,to control electrodes of the array substrate and associated commonelectrodes of the color filter substrate), the liquid crystals arealigned in a horizontal direction to display white. When a voltage lessthen V₀ is applied to the substrates, the liquid crystals are inclinedwith respect to the horizontal direction to display gray, where the grayscale is dependent on the average orientation of the molecules of theliquid crystal material.

In a small-screen LCD device, the LCD device is configured to implementa patterned vertical alignment (PVA) mode to increase the viewing angleand to decrease a gray-scale inversion. An LCD device in the PVA modehas a patterned common electrode and a patterned pixel electrode.

In some available LCD devices, a voltage applied to each of the pixelsis unstable so that the pixel flickers, resulting in a deterioration ofthe quality of the image display.

SUMMARY OF THE INVENTION

The present invention provides an array substrate capable of improvedimage display quality.

The present invention also provides a liquid crystal display (LCD) panelhaving the above-mentioned array substrate.

The present invention also provides an LCD device having theabove-mentioned array substrate.

An array substrate in accordance with an aspect of the present inventionmay include an insulating substrate, a switching element (e.g., a switchsuch as a transistor, which may be a TFT), a main pixel portion, acoupling capacitor and a sub-pixel portion. The switching element is onthe insulating substrate in a pixel region defined by gate and datalines adjacent to each other. For example, the pixel region may bedefined by a first gate line and an adjacent first data line, andfurther defined by a second gate line consecutive to the first gate lineand a second data line consecutive to the first data line. The gate anddata lines are on the insulating substrate. The main pixel portion is ona first (e.g., central) portion of the pixel region. The couplingcapacitor is electrically connected to the switching element. Thecoupling capacitor is on the insulating substrate. The sub-pixel portionis electrically connected to the coupling capacitor. The sub-pixelportion is on a second (e.g., peripheral) portion of the pixel region.

An array substrate in accordance with another aspect of the presentinvention may include an insulating substrate, a main gate line, a mainswitch, a main pixel portion, a sub-gate line, a sub-switch and asub-pixel portion. The insulating substrate has a pixel region. The maingate line is on the pixel region. The main switch is on the insulatingsubstrate. The main switch element is electrically connected to the maingate line. The main pixel portion is on a central portion of the pixelregion. The main pixel portion is electrically connected to the mainswitch. The sub-gate line is on the pixel region. The sub-switch is onthe insulating substrate. The sub-switch is electrically connected tothe sub-gate line. The sub-pixel portion is on a peripheral portion ofthe pixel region.

An LCD panel in accordance with an exemplary embodiment of the presentinvention may include an upper substrate, a lower substrate and a liquidcrystal layer. The upper substrate has a transparent substrate and acommon electrode on the transparent substrate. The lower substrate mayinclude an insulating substrate, a main pixel, a coupling capacitor anda sub-pixel portion. The insulating substrate has a pixel region definedby gate and data lines adjacent to each other. The gate and data linesare on the insulating substrate. The main pixel portion is on a first(e.g., central) portion. The coupling capacitor is electricallyconnected to a switching element on the insulating substrate. Thesub-pixel portion is electrically connected to the coupling capacitor.The sub-pixel portion is on a peripheral portion of the pixel region.The liquid crystal layer is interposed between the upper and the lowersubstrates.

An LCD device in accordance with an exemplary embodiment of the presentinvention may include an upper substrate, a lower substrate and a liquidcrystal layer. The upper substrate has a transparent substrate and acommon electrode on the transparent substrate. The lower substrate mayinclude an insulating substrate, a gate line, a data line, a switchingelement, a main pixel, a first coupling capacitor, a first sub-pixelportion, a second coupling capacitor and a second sub-pixel portion. Thegate line is on the insulating substrate to transmit a gate signal. Thedata line is on the insulating substrate to transmit a data signal. Theswitching element is electrically connected to the gate and data lines.The switching element is on the insulating substrate. The main pixelportion is electrically connected to the switching element. The mainpixel portion is on the insulating substrate. The first couplingcapacitor has a first end that is electrically connected to theswitching element. The first sub-pixel portion is electrically connectedto the switching element through the first coupling capacitor. The firstsub-pixel portion is on the insulating substrate. The second couplingcapacitor has an end that is electrically connected to the switchingelement. The second sub-pixel portion is electrically connected to theswitching element through the second coupling capacitor. The secondsub-pixel portion is on the insulating substrate. The liquid crystallayer is interposed between the upper and the lower substrates.

According to some embodiments of the present invention, a totalgate-source capacitance is divided into a gate-source capacitance of agate-source capacitor and an additional gate-source capacitance of anadditional gate-source capacitor. The gate-source capacitor and theadditional gate-source capacitor correspond to the main electrode andthe sub-electrode, respectively. As a result, a kickback voltage of themain electrode is decreased, and an image display quality of the LCDdevice is improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the present invention will become moreapparent by describing in detail exemplary embodiments thereof withreference to the accompanying drawings, in which:\

FIG. 1 is a plan view showing an LCD panel in accordance with anexemplary embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along a line I-I′ shown in FIG.1;

FIG. 3 is a circuit diagram showing an array substrate shown in FIG. 2;

FIGS. 4 to 8 are plan views showing a method of manufacturing the arraysubstrate shown in FIG. 3;

FIG. 9 is a plan view showing a gate-source capacitor in accordance withan exemplary embodiment of the present invention;

FIG. 10 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention;

FIG. 11 is a plan view showing an array substrate shown in FIG. 10;

FIG. 12 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention;

FIG. 13 is a plan view showing an array substrate shown in FIG. 12;

FIG. 14 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention;

FIG. 15 is a plan view showing an array substrate shown in FIG. 14;

FIG. 16 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention;

FIG. 17 is a plan view showing an array substrate shown in FIG. 16;

FIG. 18 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention;

FIG. 19 is a plan view showing an array substrate shown in FIG. 18;

FIG. 20 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention;

FIG. 21 is a plan view showing an array substrate shown in FIG. 20;

FIG. 22 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention; and

FIG. 23 is a plan view showing an array substrate shown in FIG. 22

DETAILED DESCRIPTION

Embodiments of the invention are described more fully hereinafter withreference to the accompanying drawings, in which embodiments of theinvention are shown. This invention may, however, be embodied in manydifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullydescribe the invention to those skilled in the art. In the drawings, thesize and relative sizes of layers and regions may be exaggerated forclarity.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention. Reference to a “first”element etc. does not imply the need for “second” or additionalelements.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including,” when used herein, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Embodiments of the invention are described herein with reference toschematic illustrations of idealized embodiments (and intermediatestructures) of the invention. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of theinvention should not be construed as limited to the particular shapes ofregions illustrated herein but are to include deviations in shapes thatresult, for example, from manufacturing. For example, an implantedregion illustrated as a rectangle will, typically, have rounded orcurved features and/or a gradient of implant concentration at its edgesrather than a binary change from implanted to non-implanted region.Likewise, a buried region formed by implantation may result in someimplantation in the region between the buried region and the surfacethrough which the implantation takes place. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the actual shape of a region of a device andare not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a plan view showing an LCD panel in accordance with anexemplary embodiment of the present invention. FIG. 2 is across-sectional view taken along a line I-I′shown in FIG. 1. Theexemplary embodiment of FIGS. 1 and 2 shows a transmissive type LCDpanel.

Referring to FIGS. 1 and 2, the LCD panel may include an array substrate100, a liquid crystal layer 180 and a color filter substrate 190. Thecolor filter substrate 190 is combined with the array substrate 100 sothat the liquid crystal layer 180 is interposed between the arraysubstrate 100 and the color filter substrate 190.

The array substrate 100 may include a gate line 110 that extends in ahorizontal direction, a gate electrode 112 that is electricallyconnected to the gate line 100, first and second lower storage patternsSTL1 and STL2 that are spaced apart from the gate line 110 in a pixelregion and substantially parallel to the gate line 110, and a firstcoupling pattern CPL that divides the pixel region into two regions. Thearray substrate 100 may include a plurality of gate lines 110, aplurality of gate electrodes 112, a plurality of pixel regions and aplurality of first coupling patterns CPL.

The array substrate 100 may include an insulating substrate 105comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 100 may further include a gate insulatinglayer 113 and an active layer 114. The gate insulating layer 113 is onthe insulating substrate 105 having the gate line 110 and the gateelectrode 112. The active layer 114 is on the gate insulating layer 113at a position corresponding to the gate electrode 112. The active layer114 comprises a semiconductor layer such as amorphous silicon,polysilicon, and/or other appropriate material, and an impurityimplanted semiconductor layer comprising N+ amorphous silicon, N+polysilicon, and/or other appropriate material.

The array substrate 100 may include a source line 120 that extends in alongitudinal direction, a source electrode 122 that is electricallyconnected to the source line 120, and a drain electrode 123 that isspaced apart from the source electrode 122. The array substrate 100 mayinclude a plurality of source lines 120, a plurality of sourceelectrodes 122, and a plurality of drain electrodes 123. Gate electrodes112, active layer 114 (including the semiconductor layers and theimpurity implanted semiconductor layers), the source electrodes 122 andthe drain electrodes 123 form one or more thin film transistors (TFTs).

The array substrate 100 may further include a first upper storagepattern 124 that is electrically connected to the drain electrode 123, afirst extended pattern 125 that is electrically connected to the drainelectrode 123 on a left side of the pixel region, a second couplingpattern 126 that is electrically connected to the first extended pattern125, a second extended pattern 127 that is electrically connected to thefirst extended pattern 125 on the left side of the pixel region, and asecond upper storage pattern 128 that is electrically connected to thesecond extended pattern 127.

The gate line 110 may have a mono-layered structure or a multi-layeredstructure. When the gate line 110 has a mono-layered structure, the gateline 110 may include aluminum, aluminum-neodymium alloy, etc. When thegate line 110 has the multi-layered structure, the gate line 110 mayinclude a lower layer portion having chromium, molybdenum, molybdenumalloy, and/or other appropriate material, and an upper layer portionhaving aluminum, aluminum alloy, and/or other appropriate material.

The array substrate 100 may further include a passivation layer 130 andan organic insulating layer 132. The passivation layer 130 covers theTFT. The passivation layer 130 and the organic insulating layer 132 havea contact hole through which the drain electrode 123 is partiallyexposed. The passivation layer 130 and the organic insulating layer 132protect the active layer 114 between the source electrode 122 and thedrain electrode 123. The TFT is electrically insulated from a pixelelectrode member 140 by the passivation layer 130 and the organicinsulating layer 132. The active layer 114 may include a semiconductorlayer and a doped (e.g., impurity implanted) semiconductor layer.

A height of the organic insulating layer 132 is controlled so that athickness of the liquid crystal layer 180 is controlled. In someembodiments, the passivation layer 130 may be omitted.

The array substrate 100 may further include the pixel electrode member140 that is electrically connected to the drain electrode 123 of the TFTthrough the contact hole. The pixel electrode member 140 has openingpatterns.

In particular, the pixel electrode member 140 may include a mainelectrode 144, a first sub-electrode 142 and a second sub-electrode 146.The main electrode 144 is electrically connected to the second couplingpattern 126. The first sub-electrode 142 is electrically connected tothe first lower storage pattern STL1. The second sub-electrode 146 isspaced apart from the first sub-electrode 142, and electricallyconnected to the second lower storage pattern STL2.

The main electrode 144 has two Y-shaped opening patterns that aresymmetrical with respect to a central line of the pixel region in thehorizontal direction of the pixel region. A central portion of each ofthe Y-shaped opening patterns has two adjacent rods that form about 90°.The first sub-electrode 142 has two linear opening patterns that aresubstantially parallel to one of the two adjacent rods of each of theY-shaped opening patterns. The second sub-electrode 146 has two linearopening patterns that are substantially parallel to another of the twoadjacent rods of each of the Y-shaped opening patterns. The linearopening patterns of the first sub-electrode 142 are symmetrical to thelinear opening patterns of the second sub-electrode 146 with respect tothe central line. In operation, a plurality of domains are formedadjacent to the opening patterns of the pixel electrode member 140 inthe liquid crystal layer 180.

The main electrode 144 and the first and second sub-electrodes 142 and146 may comprise a transparent conductive material such as indium tinoxide (ITO), amorphous indium tin oxide (a-ITO), indium zinc oxide(IZO), zinc oxide (ZO), and/or other transparent conductive material.

The color filter substrate 190 may include a transparent substrate 192,a color filter layer 194 on the transparent substrate 192, a commonelectrode 196 on the color filter layer 194. The common electrode 196covers the opening patterns of the pixel electrode member 140, and ispartially opened. The color filter substrate 190 is attached to thearray substrate 100 to seal the liquid crystal layer 180. In thisexemplary embodiment, the liquid crystal layer 180 has a verticalalignment (VA) mode.

The domains are formed by the main electrode 144 and the first andsecond sub-electrodes 142 and 146 so that a rubbing process of the arraysubstrate 100 and/or the color filter substrate 190 may be omitted. Inaddition, an alignment layer (not shown) may also be omitted.

FIG. 3 is a circuit diagram showing an array substrate shown in FIG. 2.

Referring to FIG. 3, the LCD device may include a gate line GL, a dataline DL, a thin film transistor TFT, a main pixel portion MP, a firstcoupling capacitor Ccp1, a first sub-pixel portion SP1, a secondcoupling capacitor Ccp2 and a second sub-pixel portion SP2.

A gate signal is applied to the thin film transistor TFT through thegate line GL. A data signal is applied to the thin film transistor TFTthrough the data line DL.

The main pixel portion MP may include a main liquid crystal capacitor C1cM and a main storage capacitor CstM. One end of the main liquid crystalcapacitor C1 cM is electrically connected to the thin film transistorTFT, and a common voltage Vcom is applied to the other end of the mainliquid crystal capacitor C1 cM. One end of the main storage capacitorCstM is electrically connected to the thin film transistor TFT, and astorage voltage Vst is applied to the other end of the main storagecapacitor CstM.

One end of the first coupling capacitor Ccp1 is electrically connectedto the thin film transistor TFT, and the other end of the first couplingcapacitor Ccp1 is electrically connected to the first sub-pixel portionSP1.

The first sub-pixel portion SP1 may include a first liquid crystalcapacitor Clcs1 and a first storage capacitor Csts1. One end of thefirst liquid crystal capacitor Clcs1 is electrically connected to thefirst coupling capacitor Ccp1, and the common voltage is applied to theother end of the first liquid crystal capacitor Clcs1. One end of thefirst storage capacitor Csts1 is electrically connected to the firstcoupling capacitor Ccp1, and the storage voltage Vst is applied to theother end of the first storage capacitor Csts1.

One end of the second coupling capacitor Ccp2 is electrically connectedto the thin film transistor TFT, and the other end of the secondcoupling capacitor Ccp2 is electrically connected to the second subpixel portion SP2.

The second sub-pixel portion SP2 may include a second liquid crystalcapacitor Clcs2 and a second storage capacitor Csts2. One end of thesecond liquid crystal capacitor Clcs2 is electrically connected to thesecond coupling capacitor Ccp2, and the common voltage Vcom is appliedto the other end of the second liquid crystal capacitor Clcs2. One endof the second storage capacitor Csts2 is electrically connected to thesecond coupling capacitor Ccp2, and the storage voltage Vst is appliedto the other end of the second storage capacitor Csts2.

FIGS. 4 to 8 are plan views showing a method of manufacturing the arraysubstrate shown in FIG. 3. The array substrate has contact holes thatare adjacent to the drain line adjacent to the TFT and the drain linespaced apart from the TFT, respectively. In particular, FIG. 4 is a planview showing the gate line. FIG. 5 is a plan view showing the activelayer. FIG. 6 is a plan view showing the source-drain lines. FIG. 7 is aplan view showing the organic insulating layer. FIG. 8 is a plan viewshowing the pixel electrode member.

Referring to FIGS. 2 and 4, one or more metal materials such as tantalum(Ta), titanium (Ti), molybdenum (Mo), aluminum (Al), chromium (Cr),copper (Cu), tungsten (W), and/or other metal material, is deposited onthe insulating substrate 105 comprising a transparent insulatingmaterial such as glass, ceramic, etc., thereby forming a metal layer

The deposited metal layer is patterned to form the gate lines 110 thatextend in the horizontal direction and are arranged in the longitudinaldirection, the gate electrodes 112 that are electrically connected tothe gate lines 110, the first and second lower storage patterns STL1 andSTL2 that are substantially parallel to the gate lines 110 in the pixelregion, and the first coupling pattern CPL that divides the pixel regioninto the two regions.

Silicon nitride is deposited on the insulating substrate 105 having thegate lines 110, the gate electrodes 112, the first and second lowerstorage patterns STL1 and STL2 and the first coupling pattern CPL, toform the gate insulating layer 113. In this exemplary embodiment, thesilicon nitride is deposited on the insulating substrate 105 through achemical vapor deposition process, and the gate insulating layer 113 isdeposited on an entire of the insulating substrate 105. Alternatively,the gate insulating layer 113 is patterned so that the patterned gateinsulating layer is only on the gate lines 110, the gate electrodes 112,the first and second lower storage patterns STL1 and STL2 and the firstcoupling pattern CPL.

Referring to FIG. 5, an amorphous silicon layer and an N+ amorphoussilicon layer are formed on the gate insulating layer 113. The amorphoussilicon layer and an N+ amorphous silicon layer are patterned to formthe active layer 114 on the gate electrode 112.

One or more metals such as tantalum (Ta), titanium (Ti), molybdenum(Mo), aluminum (Al), chromium (Cr), copper (Cu), tungsten (W), and/orother metal material is deposited on the gate insulating layer 113having the active layer 114, thereby forming a metal layer.

Referring to FIG. 6, the deposited metal layer is patterned to form thedata lines 120, the source electrodes 122 that are electricallyconnected to the data lines 120, the drain electrodes 123 that arespaced apart from the source electrodes 122, respectively, the firstupper storage patterns 124 that are electrically connected to the drainelectrodes 123, respectively, the first extended patterns 125 that areelectrically connected to the drain electrodes 123, respectively, thesecond coupling patterns 126 that are electrically connected to thefirst extended patterns 125, respectively, the second extended patterns127 that are electrically connected to the first extended patterns 125,respectively, and the second storage patterns 128 that are electricallyconnected to the second extended patterns 127, respectively.

A first contact hole CNTST1 is formed on each of the first upper storagepatterns 124. Each of the second coupling patterns 126 covers each ofthe first coupling patterns CPL and divides the pixel region into thetwo regions. A second contact hole CNTST2 is formed on each of thesecond upper storage patterns 128.

Referring to FIG. 2 and FIG. 7, the passivation layer 130 and theorganic insulating layer 132 are formed on the gate insulating layer 113having the active layer 114, the data lines 120, the source electrodes122, the drain electrodes 123, the first upper storage patterns 124, thefirst extended patterns 125, the second coupling patterns 126, thesecond extended patterns 127 and the second storage patterns 128. Inthis exemplary embodiment, the drain line includes the first upperstorage patterns 124, the first extended patterns 125, the secondcoupling patterns 126, the second extended patterns 127 and the secondstorage patterns 128.

A portion of the passivation layer 130 and the organic insulating layer132 in the pixel region is partially removed to form a third contacthole CNTST3 corresponding to the first contact hole CNTST1, a fourthcontact hole CNTST4 corresponding to the second contact hole CNTST2, anda fifth contact hole CNTCP corresponding to the second coupling pattern126. Pixel regions of the array substrate are defined as regions boundedby consecutive gate lines 110 and data lines 120.

Referring to FIGS. 2 and 8, the pixel electrode member 140 is formed onthe organic insulating layer 132. The pixel electrode member 140 iselectrically connected to each of the first lower storage patterns STL1through the first and third contact holes CNTST1 and CNTST3, andelectrically connected to the second lower storage pattern STL2 throughthe second and fourth contact holes CNTST2 and CNTST4. In addition, thepixel electrode member 140 is electrically connected to the secondcoupling pattern 126 through the fifth contact hole CNTCP.

In particular, the pixel electrode member 140 may include the mainelectrode 144 that is electrically connected to the second couplingpattern 126, the first sub-electrode 142 that is electrically connectedto the first lower storage pattern STL1, and the second sub-electrode146 that is electrically connected to the second lower storage patternSTL2 and spaced apart from the first lower storage pattern STL1.

The main electrode 144 has two Y-shaped opening patterns that aresymmetrical with respect to a central line of the pixel region in thehorizontal direction of the pixel region. A central portion of each ofthe Y-shaped opening patterns has two adjacent rods that form aninterior angle of about 90°. The first sub-electrode 142 has two linearopening patterns that are substantially in parallel with one of the twoadjacent rods of each of the Y-shaped opening patterns. The secondsub-electrode 146 has two linear opening patterns that are substantiallyin parallel with another of the two adjacent rods of each of theY-shaped opening patterns. The linear opening patterns of the firstsub-electrode 142 are symmetrical to the linear opening patterns of thesecond sub-electrode 146 with respect to the central line. In operation,a plurality of domains is formed adjacent to the opening patterns of thepixel electrode member 140 of the array substrate in the liquid crystallayer 180 between the array substrate and the color filter substrate.

The main electrode 144 and the first and second sub-electrodes 142 and146 include one or more transparent conductive materials such as indiumtin oxide (ITO), amorphous indium tin oxide (a-ITO), indium zinc oxide(IZO), zinc oxide (ZO), and/or other transparent conductive material.The transparent conductive material may be coated on the organicinsulating layer 132, and patterned to form the main electrode 144 andthe first and second sub-electrodes 142 and 146. Alternatively, the mainelectrode 144 and the first and second sub-electrodes 142 and 146 may beformed through different processes from each other.

In this exemplary embodiment, the main electrode 144 and the first andsecond sub-electrodes 142 and 146 are spaced apart from one another.Alternatively, the main electrode 144 may be partially overlapped withthe first and second sub-electrodes 142 and 146.

According to this exemplary embodiment, the main pixel portion is on acentral portion of the pixel region, and the sub-pixel portion is on aperipheral portion of the pixel region. The sub-pixel portion iselectrically connected to the thin film transistor through the couplingcapacitor. Therefore, a kickback voltage of the main pixel portion isdecreased.

FIG. 9 is a plan view showing a gate-source capacitor in accordance withan exemplary embodiment of the present invention.

Referring to FIG. 9, a gate-source capacitor Cgs1 is defined by anoverlapping of a gate line 110 and a drain line 120 on an active layer.In this exemplary embodiment, an additional gate-source capacitor Cgs2is defined by an overlapping of the gate line 110 and a pixel electrode142.

A total gate-source capacitance is divided into a gate-sourcecapacitance of the gate-source capacitor Cgs1 and an additionalgate-source capacitance of the additional gate-source capacitor Cgs2.The additional gate-source capacitance of the additional gate-sourcecapacitor Cgs2 corresponds to the sub-pixel portion, so that a kickbackvoltage of the main pixel portion is decreased, according to Equation 1below. In this exemplary embodiment, an area ratio of the gate-sourcecapacitor Cgs1 to the additional gate-source capacitor Cgs2 is about60:40.

The following Equation 1 represents the kickback voltage Vk.

Vk=Cgs·(Von−Voff)/(Cgs+Cst+Clc)  Equation 1

Cgs, Cst, Clc, Von and Voff represent the gate-source capacitance, astorage capacitance, a liquid crystal capacitance, a gate on voltage anda gate off voltage, respectively.

By reducing the kickback voltage, some display defects may be reduced oreliminated. For example, a malfunction caused by a root-mean square(RMS) of a pixel voltage, for example, a flicker, is decreased.

Additionally, the sub-pixel portion displays black between a zerogray-scale and a middle gray-scale, thereby decreasing an afterimage ofa low gray-scale.

FIG. 10 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 11 is a plan viewshowing an array substrate shown in FIG. 10. The array substrate has acontact hole on a layer where a drain electrode is formed adjacent to athin film transistor (TFT).

Referring to FIGS. 2, 10 and 11, the array substrate 200 may include agate line 210 that extends in a horizontal direction, a gate electrode212 that is electrically connected to the gate line 210, first andsecond lower storage patterns STL1 and STL2 that are spaced apart fromthe gate line 210 in a pixel region and substantially parallel to thegate line 210, and a first coupling pattern CPL that divides the pixelregion into two regions. In some embodiments, the array substrate 200may include a plurality of gate lines 210, a plurality of gateelectrodes 212, a plurality of pixel regions and a plurality of firstcoupling patterns CPL, where pixel regions are defined by consecutivegate lines 210 and data lines 220.

The array substrate 200 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 200 may further include a gate insulatinglayer (not shown) and an active layer 214. The gate insulating layer(not shown) is on the insulating substrate (not shown) having the gateline 210 and the gate electrode 212. The active layer 214 is on the gateinsulating layer (not shown) corresponding to the gate electrode 212.The active layer 214 comprises a semiconductor layer having amorphoussilicon, polysilicon, and/or other semiconductor material, and animpurity-doped (e.g., implanted) semiconductor layer comprising N+amorphous silicon, N+ polysilicon, and/or other doped material.

The array substrate 200 may include a source line 220 that extends in alongitudinal direction, a source electrode 222 that is electricallyconnected to the source line 220 and a drain electrode 223 that isspaced apart from the source electrode 222. In some embodiments, thearray substrate 200 may include a plurality of source lines 220, aplurality of source electrodes 222 and a plurality of drain electrodes223. Each of the gate electrodes 212, each of the semiconductor layers,each of the impurity implanted semiconductor layers, each of the sourceelectrodes 222 and each of the drain electrodes 223 form an associatedthin film transistor (TFT).

The array substrate 200 may further include a first upper storagepattern 224 that is electrically connected to the drain electrode 223, afirst extended pattern 225 that is electrically connected to the drainelectrode 223 on a left side of the pixel region, a second couplingpattern 226 that is electrically connected to the first extended pattern225, a second extended pattern 227 that is electrically connected to thefirst extended pattern 225 on the left side of the pixel region, and asecond upper storage pattern 228 that is electrically connected to thesecond extended pattern 227. In this exemplary embodiment, the firstupper storage patterns 224, the first extended patterns 225, the secondcoupling patterns 226, the second extended patterns 227 and the secondstorage patterns 228 form a drain line.

The array substrate 200 may further include a passivation layer 230 andan organic insulating layer 232. The passivation layer 230 covers theTFT. The passivation layer 230 and the organic insulating layer 232 havea contact hole through which the drain electrode 223 is partiallyexposed. The passivation layer 230 and the organic insulating layer 232protect the active layer 214 between the source electrode 222 and thedrain electrode 223. The TFT is electrically insulated from a pixelelectrode member by the passivation layer 230 and the organic insulatinglayer 232. The active layer 214 may include the semiconductor layer andthe impurity implanted semiconductor layer.

A height of the organic insulating layer 232 may be controlled so that athickness of the liquid crystal layer 200 is controlled. In someembodiments, the passivation layer 230 may be omitted.

The array substrate 200 may further include the pixel electrode memberthat is electrically connected to the second coupling pattern 224through the contact hole CNTST1. The pixel electrode member has openingpatterns.

In particular, the pixel electrode member may include a main electrode244 and a sub-electrode 242. The main electrode 244 has a wedge shapethat is protruded toward a right side of the pixel region. Thesub-electrode 242 is on a remaining portion of the pixel region wherethe main electrode 244 is not formed.

In the illustrated embodiment, the main electrode 244 has two Y-shapedopening patterns that are symmetrical with respect to a central line ofthe pixel region in the horizontal direction of the pixel region. Acentral portion of each of the Y-shaped opening patterns has twoadjacent rods that form an interior angle of about 90°. Thesub-electrode 242 is divided into a plurality of portions. In theillustrated embodiment, each of the portions of the sub-electrode 242has a substantially constant width.

The sub-electrode 242 has four linear opening patterns. Two of thelinear opening patterns are substantially parallel to an upper one ofthe two adjacent rods of each of the Y-shaped opening patterns. Theremaining two of the linear opening patterns are substantially parallelto a lower one of the two adjacent rods of each of the Y-shaped openingpatterns. The two linear opening patterns that are substantiallyparallel to the upper one of the two adjacent rods of each of theY-shaped opening patterns are symmetrical to the remaining two linearopening patterns that are substantially parallel to the lower one of thetwo adjacent rods of each of the Y-shaped opening patterns with respectto the central line.

In operation of an LCD device including array substrate 200, a pluralityof domains is formed adjacent to the opening patterns of the pixelelectrode member in the liquid crystal layer positioned between arraysubstrate 200 and a color filter substrate.

The main electrode 244 and the sub-electrode 242 comprise one or moretransparent conductive materials, such as indium tin oxide (ITO),amorphous indium tin oxide (a-ITO), indium zinc oxide (IZO), zinc oxide(ZO), and/or other transparent conductive material(s).

According to this exemplary embodiment, a total gate-source capacitanceis divided into a gate-source capacitance of the gate-source capacitorand an additional gate-source capacitance of the additional gate-sourcecapacitor. The additional gate-source capacitance of the additionalgate-source capacitor corresponds to the sub-electrode 242, so that akickback voltage of the main electrode 244 is decreased. Therefore, animage display quality of the LCD device is improved.

In addition, the number of the contact holes on an organic insulatinglayer is only two, which may improve the reliability of the LCD device,as described below.

In the exemplary embodiment discussed herein, one contact hole is formedbetween a layer where the gate line 210 is formed and a layer where thesource line 220 is formed, and another contact hole is formed between alayer where the pixel electrode member is formed and the layer where thesource line 220 is formed. Other configurations of LCD devices havethree contact holes: one contact hole between a layer where a gate lineis formed and a layer where a source line is formed, and another twocontact holes between a layer where the pixel electrode member is formedand the layer where the source line is formed. Since each contact holeincreases the probability that a short circuit may be formed, theillustrated embodiment reduces the probability of a short circuitbetween the layer where the gate line 210 is formed and the layer wherethe source line 220 is formed. A short circuit between the layer wherethe gate line 210 is formed and the layer where the source line 220 isformed may cause a malfunction of the LCD device.

In addition, only one sub-electrode is formed in each pixel region inthe illustrated embodiment. That is, the number of the sub-electrodes isdecreased so that the array substrate 200 may be easily tested. This maydecrease a manufacturing time of the LCD device.

FIG. 12 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 13 is a plan viewshowing an array substrate shown in FIG. 12. Contact holes are formed ona storage line adjacent to a TFT and on the storage line spaced apartfrom the TFT. A central portion of the storage line has a greater widththan a remaining portion of the storage line.

Referring to FIGS. 12 and 13, the array substrate 300 may include a gateline 310 that extends in a horizontal direction, a gate electrode 312that is electrically connected to the gate line 310, first and secondlower storage patterns STL1 and STL2 that are spaced apart from the gateline 310 in a pixel region and substantially parallel to the gate line310, and a first coupling pattern CPL that divides the pixel region intotwo regions. In some embodiments, the array substrate 300 may include aplurality of gate lines 310, a plurality of gate electrodes 312, aplurality of pixel regions and a plurality of first coupling patternsCPL, where pixel regions are defined by consecutive gate lines 310 anddata lines 320.

The array substrate 300 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 300 may further include a gate insulatinglayer (not shown) and an active layer 314. The gate insulating layer(not shown) is on the insulating substrate (not shown) having the gateline 310 and the gate electrode 312. The active layer 314 is on the gateinsulating layer (not shown) corresponding to the gate electrode 312.The active layer 314 has a semiconductor layer comprising amorphoussilicon, polysilicon, and/or other semiconductor material, and animpurity-doped (e.g., implanted) semiconductor layer comprising N+amorphous silicon, N+ polysilicon, and/or other doped material.

The array substrate 300 may include a source line 320 that extends in alongitudinal direction, a source electrode 322 that is electricallyconnected to the source line 320 and a drain electrode 323 that isspaced apart from the source electrode 322. In some embodiments, thearray substrate 300 may include a plurality of source lines 320, aplurality of source electrodes 322 and a plurality of drain electrodes323. Each of the gate electrodes 312, each of the semiconductor layers,each of the impurity implanted semiconductor layers, each of the sourceelectrodes 322 and each of the drain electrodes 323 form an associatedthin film transistor (TFT).

The array substrate 300 may further include a first upper storagepattern 324 that is electrically connected to the drain electrode 323and has an opening through which the lower storage pattern STL1 ispartially exposed, a first extended pattern 325 that is electricallyconnected to the first upper storage pattern 324 on a left side of thepixel region, a second coupling pattern 326 that is electricallyconnected to the first extended pattern 325, a second extended pattern327 that is electrically connected to the first extended pattern 325 onthe left side of the pixel region, and a second upper storage pattern328 that is electrically connected to the second extended pattern 327and has an opening through which the second lower storage pattern STL2is partially exposed. In this exemplary embodiment, the first upperstorage patterns 324, the first extended patterns 325, the secondcoupling patterns 326, the second extended patterns 327 and the secondstorage patterns 328 form a drain line.

The array substrate 300 may further include a passivation layer (notshown) and an organic insulating layer (not shown). The passivationlayer (not shown) covers the TFT. The passivation layer (not shown) andthe organic insulating layer (not shown) have a contact hole throughwhich the drain electrode 323 is partially exposed. The passivationlayer (not shown) and the organic insulating layer (not shown) protectthe active layer 314 between the source electrode 322 and the drainelectrode 323. The TFT is electrically insulated from a pixel electrodemember by the passivation layer (not shown) and the organic insulatinglayer (not shown). The active layer 314 may include the semiconductorlayer and the impurity implanted semiconductor layer.

The array substrate 300 may further include the pixel electrode memberthat is electrically connected to the second coupling pattern 326through a contact hole CNTCP.

In particular, the pixel electrode member may include a main electrode344, a first sub-electrode 342 and a second sub-electrode 346. The mainelectrode 344 is electrically connected to the second coupling pattern326 through the contact hole CNTCP. The first sub-electrode 342 iselectrically connected to the first lower storage pattern STL1. Thesecond sub-electrode 346 is electrically connected to the second lowerstorage pattern STL2, and spaced apart from the first sub-electrode 342.

In the illustrated embodiment, the main electrode 344 has two Y-shapedopening patterns that are symmetrical with respect to a central line ofthe pixel region in the horizontal direction of the pixel region. Acentral portion of each of the Y-shaped opening patterns has twoadjacent rods that form an interior angle of about 90°. The firstsub-electrode 342 has two linear opening patterns that are substantiallyparallel to one of the two adjacent rods of each of the Y-shaped openingpatterns. The second sub-electrode 346 has two linear opening patternsthat are substantially parallel to another of the two adjacent rods ofeach of the Y-shaped opening patterns. The linear opening patterns ofthe first sub-electrode 342 are symmetrical to the linear openingpatterns of the second sub-electrode 346 with respect to the centralline. In operation of an LCD device including array substrate 300, aplurality of domains is formed adjacent to the opening patterns of thepixel electrode member in a liquid crystal layer positioned betweenarray substrate 300 and a color filter substrate.

The main electrode 344 and the first and second sub-electrodes 342 and346 comprise one or more transparent conductive materials such as indiumtin oxide (ITO), amorphous indium tin oxide (a-ITO), indium zinc oxide(IZO), zinc oxide (ZO), and/or other transparent conductive material(s).

The domains are formed by the main electrode 344 and the first andsecond sub-electrodes 342 and 346, so that a rubbing process of thearray substrate and/or a color filter substrate may be omitted. Inaddition, an alignment layer (not shown) may also be omitted.

According to this exemplary embodiment, a total gate-source capacitanceis divided into a gate-source capacitance of the gate-source capacitorand an additional gate-source capacitance of the additional gate-sourcecapacitor. The additional gate-source capacitance of the additionalgate-source capacitor corresponds to the first and second sub-electrodes342 and 346. As a result, a kickback voltage of the main electrode 344is decreased, and the image display quality of the LCD device isimproved.

FIG. 14 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 15 is a plan viewshowing an array substrate shown in FIG. 14. In the illustratedembodiment, contact holes are formed on a drain line adjacent to a TFT,on the drain line spaced apart from the TFT, and on a central portion ofa storage line. A portion of the drain line on which the contact holesare formed has a greater width than remaining portion of the drain line.The central portion of the storage line has a greater width than aremaining portion of the storage line.

Referring to FIGS. 14 and 15, the array substrate 400 may include a gateline 410 that extends in a horizontal direction, a gate electrode 412that is electrically connected to the gate line 410, first and secondlower storage patterns STL1 and STL2 that are spaced apart from the gateline 410 in a pixel region and substantially parallel to the gate line410, and a first coupling pattern CPL that divides the pixel region intotwo regions. In some embodiments, the array substrate 400 may include aplurality of gate lines 410, a plurality of gate electrodes 412, aplurality of pixel regions and a plurality of first coupling patternsCPL, where pixel regions are defined by consecutive gate lines 410 anddata lines 420.

The array substrate 400 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 400 may further include a gate insulatinglayer (not shown) and an active layer 414. The gate insulating layer(not shown) is on the insulating substrate (not shown) having the gateline 410 and the gate electrode 412. The active layer 414 is on the gateinsulating layer (not shown) corresponding to the gate electrode 412.The active layer 414 comprises a semiconductor layer having amorphoussilicon, polysilicon, and/or other semiconductor material, and animpurity-doped (e.g., implanted) semiconductor layer having N+ amorphoussilicon, N+ polysilicon, and/or other doped material.

The array substrate 400 may include a source line 420 that extends in alongitudinal direction, a source electrode 422 that is electricallyconnected to the source line 420 and a drain electrode 423 that isspaced apart from the source electrode 422. In some embodiments, thearray substrate 400 may include a plurality of source lines 420, aplurality of source electrodes 422 and a plurality of drain electrodes423. Each of the gate electrodes 412, each of the semiconductor layers,each of the impurity implanted semiconductor layers, each of the sourceelectrodes 422 and each of the drain electrodes 423 form an associatedthin film transistor (TFT).

The array substrate 300 may further include a first upper storagepattern 424, a first extended pattern 425, a second coupling pattern426, a second extended pattern 427 and a second storage pattern 428. Inthis exemplary embodiment, the first upper storage patterns 424, thefirst extended patterns 425, the second coupling patterns 426, thesecond extended patterns 427 and the second storage patterns 428 form adrain line. In some embodiments, the array substrate 300 may furtherinclude a plurality of first upper storage patterns 424, a plurality offirst extended patterns 425, a plurality of second coupling patterns426, a plurality of second extended patterns 427 and a plurality ofsecond storage patterns 428.

The first upper storage pattern 424 is electrically connected to thedrain electrode 423, and the first upper storage pattern 424 is on thefirst lower storage pattern STL1. The first extended pattern 425 iselectrically connected to the first upper storage pattern 424 on a leftside of the pixel region. Alternatively, the first extended pattern 425may be on a central portion of the pixel region. Alternatively, thesecond coupling pattern 426 is electrically connected to the firstextended pattern 425, and covers the first coupling pattern CPL. Thesecond extended pattern 427 is electrically connected to the firstextended pattern 425 on the left side of the pixel region.Alternatively, the second extended pattern 427 may be on the centralportion of the pixel region. The second upper storage pattern 428 iselectrically connected to the second extended pattern 427, and thesecond upper storage pattern 428 is on the second lower storage patternSTL2.

The array substrate 400 may further include a passivation layer (notshown) and an organic insulating layer (not shown). The passivationlayer (not shown) covers the TFT. The passivation layer (not shown) andthe organic insulating layer (not shown) have a contact hole throughwhich the drain electrode 423 is partially exposed. The passivationlayer (not shown) and the organic insulating layer (not shown) protectthe active layer 414 between the source electrode 422 and the drainelectrode 423. The TFT is electrically insulated from a pixel electrodemember by the passivation layer (not shown) and the organic insulatinglayer (not shown). The active layer 414 may include the semiconductorlayer and the impurity implanted semiconductor layer.

The array substrate 400 may further include the pixel electrode memberthat is electrically connected to the second coupling pattern 426through a contact hole CNTCP.

In particular, the pixel electrode member may include a main electrode444, a first sub-electrode 442 and a second sub-electrode 446. The mainelectrode 444 is electrically connected to the second coupling pattern426 through the contact hole CNTCP. The first sub-electrode 442 iselectrically connected to the first lower storage pattern STL1. Thesecond sub-electrode 446 is electrically connected to the second lowerstorage pattern STL2, and spaced apart from the first sub-electrode 442.

In the illustrated embodiment, the main electrode 444 has two Y-shapedopening patterns that are symmetrical with respect to a central line ofthe pixel region in the horizontal direction of the pixel region. Acentral portion of each of the Y-shaped opening patterns has twoadjacent rods that form an interior angle of about 90°.

The first sub-electrode 442 has two linear opening patterns that aresubstantially parallel to one of the two adjacent rods of each of theY-shaped opening patterns.

The second sub-electrode 446 has two linear opening patterns that aresubstantially parallel to another of the two adjacent rods of each ofthe Y-shaped opening patterns. The linear opening patterns of the firstsub-electrode 442 are symmetrical to the linear opening patterns of thesecond sub-electrode 446 with respect to the central line. In operationof an LCD device including array substrate 400, a plurality of domainsis formed adjacent to the opening patterns of the pixel electrode memberin a liquid crystal layer positioned between array substrate 400 and acolor filter substrate.

The main electrode 444 and the first and second sub-electrodes 442 and446 comprise one or more transparent conductive materials such as indiumtin oxide (ITO), amorphous indium tin oxide (a-ITO), indium zinc oxide(IZO), zinc oxide (ZO), and/or other transparent conductive material(s).

The domains are formed by the main electrode 444 and the first andsecond sub-electrodes 442 and 446 so that a rubbing process of the arraysubstrate and/or a color filter substrate may be omitted. In addition,an alignment layer (not shown) may also be omitted.

According to this exemplary embodiment, a total gate-source capacitanceis divided into a gate-source capacitance of the gate-source capacitorand an additional gate-source capacitance of the additional gate-sourcecapacitor. The additional gate-source capacitance of the additionalgate-source capacitor corresponds to the first and second sub-electrodes442 and 446. As a result, a kickback voltage of the main electrode 444is decreased, and the image display quality of the LCD device isimproved.

FIG. 16 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 17 is a plan viewshowing an array substrate shown in FIG. 16. In the illustratedembodiment, a contact hole is formed on a drain line adjacent to a TFT.A central portion of a storage line has a greater width than a remainingportion of the storage line.

Referring to FIGS. 16 and 17, the array substrate 500 may include a gateline 510 that extends in a horizontal direction, a gate electrode 512that is electrically connected to the gate line 510, a lower storagepattern STL that is substantially parallel to the gate line 510, and afirst coupling pattern CPL that divides the pixel region into tworegions. In some embodiments, the array substrate 500 may include aplurality of gate lines 510, a plurality of gate electrodes 512, aplurality of pixel regions, a plurality of lower storage patterns STLand a plurality of first coupling patterns CPL, where pixel regions aredefined by consecutive gate lines 210 and data lines 220.

The array substrate 500 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 500 may further include a gate insulatinglayer (not shown) and an active layer 514. The gate insulating layer(not shown) is on the insulating substrate (not shown) having the gateline 510 and the gate electrode 512. The active layer 514 is on the gateinsulating layer (not shown) corresponding to the gate electrode 512.The active layer 514 comprises a semiconductor layer having amorphoussilicon, polysilicon, and/or other semiconductor material, and animpurity-doped (e.g., implanted) semiconductor layer having N+ amorphoussilicon, N+ polysilicon, and/or other doped material.

The array substrate 500 may include a source line 520 that extends in alongitudinal direction, a source electrode 522 that is electricallyconnected to the source line 520 and a drain electrode 523 that isspaced apart from the source electrode 522. In some embodiments, thearray substrate 500 may include a plurality of source lines 520, aplurality of source electrodes 522 and a plurality of drain electrodes523. Each of the gate electrodes 512, each of the semiconductor layers,each of the impurity implanted semiconductor layers, each of the sourceelectrodes 522 and each of the drain electrodes 523 form an associatedthin film transistor (TFT).

The array substrate 500 may further include a first upper storagepattern 524 that is electrically connected to the drain electrode 523, afirst extended pattern 525 that is electrically connected to the firstupper storage pattern 524 on a left side of the pixel region, and asecond coupling pattern 526 that is electrically connected to the firstextended pattern 525 to cover a first coupling pattern CPL. In someembodiments, the array substrate 500 may further include a plurality offirst upper storage patterns 524, a plurality of first extended patterns525 and a plurality of second coupling patterns 526. In this exemplaryembodiment, the first upper storage patterns 524, the first extendedpatterns 525 and the second coupling patterns 526 form a drain line.

The array substrate 500 may further include a passivation layer (notshown) and an organic insulating layer (not shown). The passivationlayer (not shown) and an organic insulating layer (not shown) cover theTFT. The passivation layer (not shown) and the organic insulating layer(not shown) protect the active layer 514 between the source electrode522 and the drain electrode 523. The TFT is electrically insulated froma pixel electrode member by the passivation layer (not shown) and theorganic insulating layer (not shown). The active layer 514 may includethe semiconductor layer and the impurity implanted semiconductor layer.

The array substrate 500 may further include the pixel electrode memberthat is electrically connected to the second coupling pattern 526through the contact hole CNTCP. The pixel electrode member has openingpatterns.

In particular, the pixel electrode member may include a main electrode544 and a sub-electrode 542. The main electrode 544 has a wedge shapethat is protruded toward a right side of the pixel region. Thesub-electrode 542 is on a remaining portion of the pixel region wherethe main electrode 544 is not formed.

In the illustrated embodiment, the main electrode 544 has two Y-shapedopening patterns that are symmetrical with respect to a central line ofthe pixel region in the horizontal direction of the pixel region. Acentral portion of each of the Y-shaped opening patterns has twoadjacent rods that form an interior angle of about 90°. Thesub-electrode 542 is divided into a plurality of portions. Each of theportions of the sub-electrode 542 has a substantially constant width.

The sub-electrode 542 has four linear opening patterns. Two of thelinear opening patterns are substantially parallel to an upper one ofthe two adjacent rods of each of the Y-shaped opening patterns. Theremaining two of the linear opening patterns are substantially parallelto the lower one of the two adjacent rods of each of the Y-shapedopening patterns. The two linear opening patterns that are substantiallyparallel to the upper one of the two adjacent rods of each of theY-shaped opening patterns are symmetrical to the remaining two linearopening patterns that are substantially parallel to the lower one of thetwo adjacent rods of each of the Y-shaped opening patterns with respectto the central line.

Alternatively, the sub-electrode 542 may have the wedge shape and theY-shaped opening patterns, and the main electrode 544 may have thelinear opening patterns.

In operation of an LCD device including array substrate 500, a pluralityof domains is formed adjacent to the opening patterns of the pixelelectrode member in the liquid crystal layer positioned between arraysubstrate 500 and a color filter substrate.

The main electrode 544 and the sub-electrode 542 comprise one or moretransparent conductive materials such as indium tin oxide (ITO),amorphous indium tin oxide (a-ITO), indium zinc oxide (IZO), zinc oxide(ZO), and/or other transparent conductive material(s).

The domains are formed by the main electrode 544 and the sub-electrode542 so that a rubbing process of the array substrate 500 and/or thecolor filter substrate may be omitted. In addition, an alignment layer(not shown) may also be omitted.

According to this exemplary embodiment, a total gate-source capacitanceis divided into a gate-source capacitance of the gate-source capacitorand an additional gate-source capacitance of the additional gate-sourcecapacitor. The additional gate-source capacitance of the additionalgate-source capacitor corresponds to the sub-electrode 542. As a result,a kickback voltage of the main electrode 544 is decreased, and the imagedisplay quality of the LCD device is improved.

In addition, the number of the contact holes on an organic insulatinglayer is only two, which may improve the reliability of the LCD device,as described below.

In the exemplary embodiment discussed herein, one contact hole is formedbetween a layer where the gate line 510 is formed and a layer where thesource line 520 is formed, and another contact hole is formed between alayer where the pixel electrode member is formed and the layer where thesource line 520 is formed. Other configurations of LCD devices havethree contact holes: one contact hole between a layer where a gate lineis formed and a layer where a source line is formed, and another twocontact holes between a layer where the pixel electrode member is formedand the layer where the source line is formed. Since each contact holeincreases the probability that a short circuit may be formed, theillustrated embodiment reduces the probability of a short circuitbetween the layer where the gate line 510 is formed and the layer wherethe source line 520 is formed. A short circuit between the layer wherethe gate line 510 is formed and the layer where the source line 520 isformed may cause a malfunction of the LCD device.

In addition, only one sub-electrode is formed in each pixel region inthe illustrated embodiment. That is, the number of sub-electrodes isdecreased so that the array substrate 500 may be easily tested. This maydecrease a manufacturing time of the LCD device.

FIG. 18 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 19 is a plan viewshowing an array substrate shown in FIG. 18. In the illustratedembodiment, contact holes are formed on a drain line adjacent to a TFT,on the drain line spaced apart from the TFT and on a storage line. Firstand second extended patterns are along a central line of a pixel regionin the longitudinal direction of the pixel region.

Referring to FIGS. 18 and 19, the array substrate 600 may include a gateline 610 that extends in a horizontal direction, a gate electrode 612that is electrically connected to the gate line 610, first and secondlower storage patterns STL1 and STL2 that are spaced apart from the gateline 610 in a pixel region and substantially parallel to the gate line610, and a first coupling pattern CPL that divides the pixel region intotwo regions. In some embodiments, the array substrate 600 may include aplurality of gate lines 610, a plurality of gate electrodes 612, aplurality of pixel regions and a plurality of first coupling patternsCPL.

The array substrate 600 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 600 may further include a gate insulatinglayer (not shown) and an active layer 614. The gate insulating layer(not shown) is on the insulating substrate (not shown) having the gateline 610 and the gate electrode 612. The active layer 614 is on the gateinsulating layer (not shown) corresponding to the gate electrode 612.The active layer 614 comprises a semiconductor layer having amorphoussilicon, polysilicon, and/or other semiconductor material, and animpurity-doped (e.g., implanted) semiconductor layer having N+ amorphoussilicon, N+ polysilicon, and/or other doped material.

The array substrate 600 may include a source line 620 that extends in alongitudinal direction, a source electrode 622 that is electricallyconnected to the source line 620, and a drain electrode 623 that isspaced apart from the source electrode 622. In some embodiments, thearray substrate 600 may include a plurality of source lines 620, aplurality of source electrodes 622 and a plurality of drain electrodes623. Each of the gate electrodes 612, each of the semiconductor layers,each of the impurity implanted semiconductor layers, each of the sourceelectrodes 622 and each of the drain electrodes 623 form an associatedthin film transistor (TFT).

The array substrate 600 may further include a first upper storagepattern 624, a first extended pattern 625, a second coupling pattern626, a second extended pattern 627 and a second upper storage pattern628. In some embodiments, the array substrate 600 may further include aplurality of first upper storage patterns 624, a plurality of firstextended patterns 625, a plurality of second coupling patterns 626, aplurality of second extended patterns 627 and a plurality of secondupper storage patterns 628. In this exemplary embodiment, the firstupper storage patterns 624, the first extended patterns 625, the secondcoupling patterns 626, the second extended patterns 627 and the secondstorage patterns 628 form a drain line.

In particular, the first upper storage pattern 624 is electricallyconnected to the drain electrode 623, and the first upper storagepattern 624 is on the first lower storage pattern STL1. The firstextended pattern 625 is electrically connected to the first upperstorage pattern 624 on a central line of the pixel region in alongitudinal direction of the pixel line. The second coupling pattern626 is electrically connected to the first extended pattern 625, andcovers the first coupling pattern CPL. The second extended pattern 627is electrically connected to the first extended pattern 625 on thecentral line of the pixel region in the longitudinal direction. Thesecond upper storage pattern 628 is electrically connected to the secondextended pattern 627, and the second upper storage pattern 628 is on thesecond lower storage pattern STL2.

The array substrate 600 may further include a passivation layer (notshown) and an organic insulating layer (not shown). The passivationlayer (not shown) covers the TFT. The passivation layer (not shown) andthe organic insulating layer (not shown) have a contact hole throughwhich the drain electrode 623 is partially exposed. The passivationlayer (not shown) and the organic insulating layer (not shown) protectthe active layer 614 between the source electrode 622 and the drainelectrode 623. The TFT is electrically insulated from a pixel electrodemember by the passivation layer (not shown) and the organic insulatinglayer (not shown). The active layer 614 may include the semiconductorlayer and the impurity implanted semiconductor layer.

The array substrate 600 may further include a pixel electrode memberthat is electrically connected to the second coupling pattern 626through a contact hole CNTCP.

In particular, the pixel electrode member may include a main electrode644, a first sub-electrode 642 and a second sub-electrode 646. The mainelectrode 644 is electrically connected to the second coupling pattern626 through the contact hole CNTCP. The first sub-electrode 642 iselectrically connected to the first lower storage pattern STL1. Thesecond sub-electrode 646 is electrically connected to the second lowerstorage pattern STL2, and spaced apart from the first sub-electrode 642.

In the illustrated embodiment, the main electrode 644 has two Y-shapedopening patterns that are symmetrical with respect to a central line ofthe pixel region in the horizontal direction of the pixel region. Acentral portion of each of the Y-shaped opening patterns has twoadjacent rods that form about an interior angle of about 90°.

The first sub-electrode 642 has two linear opening patterns that aresubstantially parallel to one of the two adjacent rods of each of theY-shaped opening patterns.

The second sub-electrode 646 has two linear opening patterns that aresubstantially parallel to another of the two adjacent rods of each ofthe Y-shaped opening patterns. The linear opening patterns of the firstsub-electrode 642 are symmetrical to the linear opening patterns of thesecond sub-electrode 646 with respect to the central line. In operationof an LCD device including array substrate 600, a plurality of domainsis formed adjacent to the opening patterns of the pixel electrode memberin a liquid crystal layer positioned between array substrate 600 and acolor filter substrate.

The main electrode 644 and the first and second sub-electrodes 642 and646 comprise a transparent conductive material such as indium tin oxide(ITO), amorphous indium tin oxide (a-ITO), indium zinc oxide (IZO), zincoxide (ZO), and/or other transparent conductive material.

The domains are formed by the main electrode 644 and the first andsecond sub-electrodes 642 and 646 so that a rubbing process of the arraysubstrate and/or a color filter substrate may be omitted. In addition,an alignment layer (not shown) may also be omitted.

According to this exemplary embodiment, a total gate-source capacitanceis divided into a gate-source capacitance of the gate-source capacitorand an additional gate-source capacitance of the additional gate-sourcecapacitor. The additional gate-source capacitance of the additionalgate-source capacitor corresponds to the first and second sub-electrodes642 and 646. As a result, a kickback voltage of the main electrode 644is decreased, and the image display quality of the LCD device may beimproved.

In addition, the first and second extended patterns 625 and 627 are onthe central line of the pixel region to prevent a short circuit betweena layer where the source line 620 is formed and a layer where the gateline 610 is formed.

FIG. 20 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 21 is a plan viewshowing an array substrate shown in FIG. 20. In the illustratedembodiment, contact holes are formed on a drain line spaced apart fromthe TFT. First and second extended patterns are along a central line ofa pixel region in the longitudinal direction of the pixel region.

Referring to FIGS. 20 and 21, the array substrate 700 may include a gateline 710 that extends in a horizontal direction, a gate electrode 712that is electrically connected to the gate line 710, first and secondlower storage patterns STL1 and STL2 that are spaced apart from the gateline 710 in a pixel region and substantially parallel to the gate line710, and a first coupling pattern CPL that divides the pixel region intotwo regions. In some embodiments, the array substrate 700 may include aplurality of gate lines 710, a plurality of gate electrodes 712, aplurality of pixel regions and a plurality of first coupling patternsCPL, where pixel regions are defined by consecutive gate lines 210 anddata lines 220.

The array substrate 700 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 700 may further include a gate insulatinglayer (not shown) and an active layer 714. The gate insulating layer(not shown) is on the insulating substrate (not shown) having the gateline 710 and the gate electrode 712. The active layer 714 is on the gateinsulating layer (not shown) corresponding to the gate electrode 712.The active layer 714 comprises a semiconductor layer having amorphoussilicon, polysilicon, and/or other semiconductor material, and animpurity-doped (e.g., implanted) semiconductor layer having N+ amorphoussilicon, N+ polysilicon, and/or other doped material.

The array substrate 700 may include a source line 720 that extends in alongitudinal direction, a source electrode 722 that is electricallyconnected to the source line 720 and a drain electrode 723 that isspaced apart from the source electrode 722. In some embodiments, thearray substrate 700 may include a plurality of source lines 720, aplurality of source electrodes 722 and a plurality of drain electrodes723. Each of the gate electrodes 712, each of the semiconductor layers,each of the impurity implanted semiconductor layers, each of the sourceelectrodes 722 and each of the drain electrodes 723 form an associatedthin film transistor (TFT).

The array substrate 700 may further include a first upper storagepattern 724, a first extended pattern 725, a second coupling pattern726, a second extended pattern 727 and a second upper storage pattern728. In some embodiments, the array substrate 700 may further include aplurality of first upper storage patterns 724, a plurality of firstextended patterns 725, a plurality of second coupling patterns 726, aplurality of second extended patterns 727 and a plurality of secondupper storage patterns 728. In this exemplary embodiment, the firstupper storage patterns 724, the first extended patterns 725, the secondcoupling patterns 726, the second extended patterns 727 and the secondstorage patterns 728 form a drain line.

In particular, the first upper storage pattern 724 is electricallyconnected to the drain electrode 723, and the first upper storagepattern 724 is on the first lower storage pattern STL1. The firstextended pattern 725 is electrically connected to the first upperstorage pattern 724 on a central line of the pixel region in alongitudinal direction of the pixel region. The second coupling pattern726 is electrically connected to the first extended pattern 725, andcovers the first coupling pattern CPL. The second extended pattern 727is electrically connected to the first extended pattern 725 on thecentral line of the pixel region in the longitudinal direction. Thesecond upper storage pattern 728 is electrically connected to the secondextended pattern 727, and the second upper storage pattern 728 is on thesecond lower storage pattern STL2.

The array substrate 700 may further include a passivation layer (notshown) and an organic insulating layer (not shown). The passivationlayer (not shown) covers the TFT. The passivation layer (not shown) andthe organic insulating layer (not shown) have a contact hole throughwhich the drain electrode 723 is partially exposed. The passivationlayer (not shown) and the organic insulating layer (not shown) protectthe active layer 714 between the source electrode 722 and the drainelectrode 723. The TFT is electrically insulated from a pixel electrodemember by the passivation layer (not shown) and the organic insulatinglayer (not shown). The active layer 714 may include the semiconductorlayer and the impurity implanted semiconductor layer.

The array substrate 700 may further include a pixel electrode memberthat is electrically connected to the second coupling pattern 726through a contact hole CNTCP.

In particular, the pixel electrode member may include a main electrode742 and a sub-electrode 744. The sub-electrode 744 has a wedge shapethat is protruded toward a right side of the pixel region. The mainelectrode 742 is on a remaining portion of the pixel region where thesub-electrode 744 is not formed.

In the illustrated embodiment, the sub-electrode 744 has two Y-shapedopening patterns that are symmetrical with respect to a central line ofthe pixel region in the horizontal direction of the pixel region. Acentral portion of each of the Y-shaped opening patterns has twoadjacent rods that form an interior angle of about 90°. Thesub-electrode 744 is divided into a plurality of portions by theY-shaped opening patterns. Each of the portions of the sub-electrode 744has a substantially constant width.

The main electrode 742 has four linear opening patterns. Two of thelinear opening patterns are substantially parallel to an upper one ofthe two adjacent rods of each of the Y-shaped opening patterns. Theremaining two of the linear opening patterns are substantially parallelto a lower one of the two adjacent rods of each of the Y-shaped openingpatterns. The two linear opening patterns that are substantiallyparallel to the upper one of the two adjacent rods of each of theY-shaped opening patterns are symmetrical to the remaining two linearopening patterns that are substantially parallel to the lower one of thetwo adjacent rods of each of the Y-shaped opening patterns with respectto the central line.

In operation of an LCD device including array substrate 700, a pluralityof domains is formed adjacent to the opening patterns of the pixelelectrode member in the liquid crystal layer positioned between arraysubstrate 700 and a color filter substrate.

The main electrode 742 and the sub-electrodes 744 comprise a transparentconductive material such as indium tin oxide (ITO), amorphous indium tinoxide (a-ITO), indium zinc oxide (IZO), zinc oxide (ZO), and/or othertransparent conductive material.

According to this exemplary embodiment, a total gate-source capacitanceis divided into a gate-source capacitance of the gate-source capacitorand an additional gate-source capacitance of the additional gate-sourcecapacitor. The additional gate-source capacitance of the additionalgate-source capacitor corresponds to the sub-electrode 742. As a result,a kickback voltage of the main electrode 744 is decreased, and the imagedisplay quality of the LCD device is improved.

In addition, the number of the contact holes on an organic insulatinglayer is only two, which may improve the reliability of the LCD device,as described below.

In the exemplary embodiment described herein, one contact hole is formedbetween a layer where the gate line 710 is formed and a layer where thesource line 720 is formed, and another contact hole is formed between alayer where the pixel electrode member is formed and the layer where thesource line 720 is formed. Other configurations of LCD devices havethree contact holes: one contact hole between a layer where a gate lineis formed and a layer where a source line is formed, and another twocontact holes between a layer where the pixel electrode member is formedand the layer where the source line is formed. Since each contact holeincreases the probability that a short circuit may be formed, theillustrated embodiment reduces the probability of a short circuitbetween the layer where the gate line 710 is formed and the layer wherethe source line 720 is formed. A short circuit between the layer wherethe gate line 710 is formed and the layer where the source line 720 isformed may cause a malfunction of the LCD device.

In addition, only one sub-electrode is formed in each pixel region inthe illustrated embodiment. That is, the number of the sub-electrodes isdecreased so that the array substrate 200 may be easily tested. This maydecrease a manufacturing time of the LCD device.

Furthermore, the first and second extended patterns 725 and 727 are onthe central line of the pixel region to prevent a short circuit betweena layer where the source line 720 is formed and a layer where the gateline 710 is formed.

In this exemplary embodiment, one TFT is formed in each pixel region. Insome embodiments, a plurality of TFTs may be formed in each pixelregion.

FIG. 22 is a plan view showing an LCD panel in accordance with anotherexemplary embodiment of the present invention. FIG. 23 is a plan viewshowing an array substrate shown in FIG. 22. In the illustratedembodiment, two TFTs are formed on each pixel region. A main pixel is ona central portion of the pixel region, and a sub-pixel is on aperipheral portion of the pixel region.

Referring to FIGS. 22 and 23, the array substrate 800 may include firstand second gate lines 810M and 810S that are extended in a horizontaldirection, first and second gate electrodes 812M and 812S that areelectrically connected to the first and second gate lines 810M and 810S,respectively, a first lower storage pattern STL that is spaced apartfrom the first and second gate lines 810M and 810S in the pixel regionand substantially perpendicular to the first gate line 810M, and a firstcoupling pattern CPL that divides the pixel region into two regions. Thefirst coupling pattern CPL is electrically connected to the first lowerstorage pattern STL adjacent to a right side of the pixel region. Insome embodiments, the array substrate 800 may include a plurality offirst lower storage patterns STL and a plurality of first couplingpatterns CPL.

The array substrate 800 may include an insulating substrate (not shown)comprising silicon nitride, silicon oxide, and/or other insulatingmaterial. The array substrate 800 may further include a gate insulatinglayer (not shown) and first and second active layers 814M and 814S. Thegate insulating layer (not shown) is on the insulating substrate (notshown) having the first and second gate lines 810M and 810S and thefirst and second gate electrodes 812M and 812S. The first and secondactive layers 814M and 814S are on the gate insulating layer (not shown)corresponding to the first and second gate electrodes 812M and 812S,respectively. Each of the first and second active layers 814M and 814Scomprises a semiconductor layer having amorphous silicon, polysilicon,and/or other semiconductor material, and an impurity-doped (e.g.,implanted) semiconductor layer having N+ amorphous silicon, N+polysilicon, and/or other doped material.

The array substrate 800 may include a source line 820 that extends in alongitudinal direction, first and second source electrodes 822M and 822Sthat are electrically connected to the source line 820, and first andsecond drain electrodes 823M and 823S that are spaced apart from thefirst and second source electrodes 822M and 822S. In some embodiments,the array substrate 800 may include a plurality of source lines 820.Each of the first gate electrodes 812M, each of the semiconductorlayers, each of the impurity implanted semiconductor layers, each of thefirst source electrodes 822M and each of the first drain electrodes 823Mform an associated main TFT. Each of the second gate electrodes 812S,each of the semiconductor layers, each of the impurity implantedsemiconductor layers, each of the second source electrodes 822S and eachof the second drain electrodes 823S form an associated sub-TFT.

The array substrate 800 may further include a first extended pattern825M that is electrically connected to the first drain electrode 823Mand adjacent to a left side of the pixel region, a first upper storagepattern 824M that is electrically connected to the first extendedpattern 825M and on the first coupling pattern CPL, a second upperstorage pattern 824S that is electrically connected to the second drainelectrode 823S and on the first lower storage pattern STL, and a secondextended pattern 825S that is electrically connected to the second upperstorage pattern 824S and adjacent to a right side of the pixel region.In some embodiments, the array substrate 800 may further include aplurality of first extended patterns 825M, a plurality of first upperstorage patterns 824M, a plurality of second upper storage patterns824S, and a plurality of second extended patterns 825S. In thisexemplary embodiment, the first upper storage patterns 824M and thefirst extended patterns 825M form a first drain line, and the secondupper storage patterns 824S and the second extended pattern 825S form asecond drain line.

The array substrate 800 may further include a second coupling pattern826 that is electrically connected to the first drain electrode 823M andcovers the first coupling pattern CPL. In some embodiments, the arraysubstrate 800 may further include a plurality of second couplingpatterns 826.

The array substrate 800 may further include a passivation layer (notshown) and an organic insulating layer (not shown). The passivationlayer (not shown) covers the main TFT and the sub-TFT. The passivationlayer (not shown) and the organic insulating layer (not shown) havecontact holes through which the second upper storage pattern 824S andthe second coupling pattern 826 are partially exposed.

The passivation layer (not shown) and the organic insulating layer (notshown) protect the first active layer 814M between the first sourceelectrode 822M and the first drain electrode 823M, and the second activelayer 814S between the second source electrode 822S and the second drainelectrode 823S. The main TFT and the sub-TFT are electrically insulatedfrom a pixel electrode member by the passivation layer (not shown) andthe organic insulating layer (not shown). Each of the first and secondactive layers 814M and 814S may include the semiconductor layer and theimpurity implanted semiconductor layer.

The array substrate 800 may further include a main electrode 844 and asub-electrode 842. The main electrode 844 is electrically connected tothe second coupling pattern 826 through a contact hole CNTCP. Thesub-electrode 842 is electrically connected to the second storagepattern 824S through a first contact hole CNTST1.

The main electrode 844 has a wedge shape that is protruded toward aright side of the pixel region. The sub-electrode 842 is on a remainingportion of the pixel region where the main electrode 844 is not formed.

The main electrode 844 has two V-shaped opening patterns that aresymmetrical with respect to a central line of the pixel region in thehorizontal direction of the pixel region. End portions of the smallerone of the V-shaped opening patterns are opened, and a central portionof the smaller one of the V-shaped opening patterns is closed. A centralportion of the larger one of the V-shaped opening patterns is opened. Acentral portion of each of the V-shaped opening patterns has twoadjacent rods that form an interior angle of about 90°. The mainelectrode 844 is divided into a plurality of portions by the V-shapedopening patterns. The divided portions of the main electrode 844 areelectrically connected to one another. Each of the portions of the mainelectrode 844 has a substantially constant width.

The sub-electrode 842 has four linear opening patterns. Two of thelinear opening patterns are substantially parallel to an upper one ofthe two adjacent rods of each of the Y-shaped opening patterns. Theremaining two of the linear opening patterns are substantially parallelto the lower one of the two adjacent rods of each of the Y-shapedopening patterns. The two linear opening patterns that are substantiallyparallel to the upper one of the two adjacent rods of each of theY-shaped opening patterns are symmetrical to the remaining two linearopening patterns that are substantially parallel to the lower one of thetwo adjacent rods of each of the Y-shaped opening patterns with respectto the central line.

In operation of an LCD device including an array substrate 800, aplurality of domains is formed adjacent to the opening patterns of thepixel electrode member in the liquid crystal layer.

The main electrode 844 and the sub-electrodes 842 comprise a transparentconductive material such as indium tin oxide (ITO), amorphous indium tinoxide (a-ITO), indium zinc oxide (IZO), zinc oxide (ZO), and/or othertransparent conductive material.

The domains are formed by the main electrode 844 and the sub-electrode842 so that a rubbing process of the array substrate and/or a colorfilter substrate may be omitted. In addition, an alignment layer (notshown) may also be omitted.

According to embodiments of the present invention, a total gate-sourcecapacitance is divided into a gate-source capacitance of the gate-sourcecapacitor and an additional gate-source capacitance of the additionalgate-source capacitor. The additional gate-source capacitance of theadditional gate-source capacitor corresponds to the sub-electrode. As aresult, a kickback voltage of the main electrode is decreased, and theimage display quality of the LCD device may be improved.

Additionally, the sub-pixel portion displays black between a zerogray-scale and a middle gray-scale, thereby decreasing an afterimage ofa low gray-scale.

Furthermore, the number of the contact holes on an organic insulatinglayer is decreased, which may improve the reliability of the LCD device.

In the embodiment discussed herein, one contact hole is formed between alayer where the gate line is formed and a layer where the source line isformed, and another contact hole is formed between a layer where thepixel electrode member is formed and the layer where the source line isformed. Other configurations of LCD devices have three contact holes:one contact hole between a layer where a gate line is formed and a layerwhere a source line is formed, and another two contact holes between alayer where the pixel electrode member is formed and the layer where thesource line is formed. Since each contact hole increases the probabilitythat a short circuit may be formed, the illustrated embodiment reducesthe probability of a short circuit between the layer where the gate lineis formed and the layer where the source line is formed.

In addition, only one sub-electrode is formed in each pixel region. Thatis, the number of the sub-electrodes, is decreased so that the arraysubstrate may be easily tested, and a manufacturing time of the LCDdevice may be decreased.

Furthermore, a portion of the drain line is on the central line of thepixel region, which may decrease the probability of a short circuitbetween the source line and the drain line.

This invention has been described with reference to the exemplaryembodiments. It is evident, however, that many alternative modificationsand variations will be apparent to those having skill in the art inlight of the foregoing description. Accordingly, the present inventionembraces all such alternative modifications and variations as fallwithin the spirit and scope of the appended claims.

1. An array substrate comprising: an insulating substrate; a switchingtransistor comprising a gate electrode, a source electrode and a drainelectrode on the insulating substrate in a pixel region; a gate lineelectrically coupled to the gate electrode; a data line electricallycoupled to the source electrode; a main pixel electrode formed in thecenter region of the pixel region and electrically coupled to the drainelectrode; a sub-pixel electrode formed in an edge region of the pixelregion; and a coupling capacitor electrically coupling the drainelectrode and the sub-pixel electrode.